Media Alert: Rambus to Demo High-speed IP Cores at the TSMC Open Innovation Platform Ecosystem Forum Pavilion in Santa Clara

Rambus Inc. (Nasdaq: RMBS):

To learn more about the TSMC 2018 Open Innovation Platform Ecosystem Forum, visit rambus.com/event/tsmc-oip-2018/. For more information on our latest Rambus high-speed memory and SerDes PHY solutions, visit rambus.com/memory-and-interfaces/.

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About Rambus Memory and Interfaces Division

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products and technologies power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.

Source: Rambus Inc.

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