Therma-Wave Launches New Opti-Probe 7341XP Metrology Tool; Opti-Probe

    Business Editors/High-Tech Editors

    FREMONT, Calif.--(BUSINESS WIRE)--Feb. 3, 2005--Therma-Wave, Inc. (Nasdaq:TWAV), a worldwide leader in the development, manufacture and sale of process control metrology systems used in the manufacture of semiconductors, today launched the Opti-Probe 7341XP, a thin-film and critical dimension (CD) metrology tool. This latest extension of Therma-Wave's widely deployed Opti-Probe line of thin-film measurement tools delivers to semiconductor manufacturers a metrology solution for high-volume 65nm chip production that yields better precision and productivity than earlier generation Opti-Probes. Comprehensive field data for Therma-Wave's OP 7341XP demonstrates an improvement in performance for its customers' most critical thin-film and optical CD applications by a factor of up to two times. With more than 1,200 Opti-Probe tools installed worldwide, the Opti-Probe 7341XP seeks to extend Therma-Wave's presence at the leading edge of thin-film and CD metrology.
    Advanced thin-films used in semiconductor manufacturing at the 65nm technology node and beyond create new demands for thin-film metrology. Today's technology must address increasing requirements for precision measurement of ever-thinner films and more complex materials on smaller integrated circuit (IC) devices with no loss in throughput. The Opti-Probe 7341XP leverages Therma-Wave's field-proven Series-7 Opti-Probe platform, which combines five distinct film measurement technologies needed to meet the increasingly complex demands of process control.
    "Therma-Wave continues to develop solutions to meet the changing technology needs of its customers. Existing methods and tools for thin-film metrology are reaching the limit of their precision capabilities at production throughputs," said Boris Lipkin, president and CEO of Therma-Wave. "Building on the reliability of the Opti-Probe 7341 system, the XP model addresses the specific requirements of 65nm wafer fabrication by dramatically increasing measurement repeatability and productivity. This makes it an ideal solution for 65nm thin-film and optical CD measurements, and we have already aligned our product roadmap to take advantage of future growth opportunities as more advanced semiconductor plants come on line."
    Through Therma-Wave's ongoing development work in improving critical optical components and system efficiency, the Opti-Probe 7341XP is raising the bar for spectroscopic-based metrology with capabilities that specifically address the high precision, efficiency and matching needs of 65nm wafer fab production. "Even though the Opti-Probe 7341XP is newly introduced, it has already established strong market acceptance for both 90nm and 65nm applications. Therma-Wave has already installed early deployments of the Opti-Probe 7341XP at several major semiconductor manufacturers for 90nm wafer fab production and emerging 65nm applications, putting Therma-Wave in a strong position for future growth," noted Mr. Lipkin.
    The improvement in the spectroscopic ellipsometer (SE) performance associated with the Opti-Probe 7341XP is of particular benefit to Therma-Wave's optical CD capabilities, via either Real Time CD (RT/CD(R)) or Tokyo Electron (TEL)/Timbre Optical Digital Profilometry (ODP(TM)). The ability to produce accurate and repeatable 2-D and 3-D profile and CD information via non-contact, high productivity techniques is critical for 65nm production needs. The Opti-Probe 7341XP delivers higher precision and higher productivity and significantly improved tool-to-tool matching for optical CD measurements over previous offerings and has successfully been inserted into the 65nm process flow.
    The Opti-Probe 7341XP also includes Therma-Wave's recently released second-generation versions of the environmental film desorber(R) (EFD(R)), and wafer -bow/warp/stress (WBWS(R)) measurement options. Both these options have been designed to improve the effectiveness of the Opti-Probe Series-7 platform in enabling higher yields for 65nm production. The EFD removes surface contamination safely, even from delicate Silicon-On-Insulator (SOI) wafers, enabling more accurate measurements of the most critical ultra-thin films with no impact on throughput. WBWS measures film stress both globally across the wafer and locally in the form of wafer-deflection mapping, improving process-monitoring capabilities. In addition, existing 200 mm and 300 mm Opti-Probe 7341 tools in the field can be upgraded to the XP model through the optical CD, EFD and WBWS options, giving customers product versatility and extendibility to maximize their return on investment in Therma-Wave's metrology tools.

    About Therma-Wave, Inc.

    Since 1982, Therma-Wave, Inc. has been revolutionizing process control metrology systems through innovative proprietary products and technologies. The company is a worldwide leader in the development, manufacture, marketing and service of process control metrology systems used in the manufacture of semiconductors. Therma-Wave currently offers leading-edge products to the semiconductor manufacturing industry for the measurement of transparent, semi-transparent, and opaque thin films; for the measurement of critical dimensions and profile of IC features; for the monitoring of ion implantation; and for the integration of metrology into semiconductor processing systems. For further information about Therma-Wave, Inc., access the web site at: www.thermawave.com.

    This press release contains forward-looking statements as that term is defined in the Private Securities Reform Act of 1995, which are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such statements relating to our technology leadership and continued customer acceptance of our products are based on current expectations. Such statements are subject to risks, uncertainties and changes in condition, particularly those related to industry performance and other risks, some of which are detailed in documents filed with the Securities and Exchange Commission including specifically Exhibit 99.1 to the Company's annual report on Form 10-K for the year ended March 28, 2004. The Company undertakes no obligation to update the information in this press release.

    Note: Opti-Probe is a registered trademark of Therma-Wave, Inc.

    Note: ODP is a trademark of Tokyo Electron Limited.

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CONTACT: Therma-Wave, Inc. Ray Christie, 510-668-2215 rchristie@thermawave.com

KEYWORD: CALIFORNIA INDUSTRY KEYWORD: HARDWARE MANUFACTURING PRODUCT SOURCE: Therma-Wave, Inc.

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