11.07.2006 17:04:00

SUSS MicroTec Enhances the BlueRay(TM) Probe System; The World's Only Prober That Can Be Upgraded on Site from a Semiautomatic to Fully-Automated System

SUSS MicroTec AG (FWB:SMH) (GER:SMH) has introduced thelatest innovation of the BlueRay(TM) probe system, a high-throughputwafer prober capable of testing up to 70,000 dies per hour. It is nowthe world's only prober that can be upgraded from a semiautomatic to afully-automated probe station in the field.

As the demand for discrete devices, MEMS, RF and optosemicondutordevices grows, manufacturers need a test system that can grow withtheir production needs. Producers also need efficient test processesto meet cost pressures and reduce time to market. SUSS recognizedthese factors and provides manufacturers with the test solution thatfits their needs for today and in the future.

To meet growing production demands, a unique, wafer-handling robotcan be docked onto the BlueRay probe system. Once completely docked,the robot handles all wafers automatically. The system is so flexiblethat the wafer-handling robot can be removed and docked onto anotherBlueRay as needed. Docking and undocking is quick and done on site,reducing down time to a minimum. In addition, the test platform cannow remain constant from ramp-up to production, which minimizeschangeover costs and capital investments.

"The BlueRay probe system is the most unique on-wafer testplatform available today," said Stojan Kanev, International ProductManager for Test Systems at SUSS MicroTec. "Not only does it enablethe device maker to test non-electrical properties with high precisionand throughput, but it also provides a common test platform formanufacturers from ramp-up to production test. Essentially, it's thebridge from lab to fab."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process andtest technology for the semiconductor industry. SUSS maintains itsleadership position with over 7,000 systems installed worldwide. SUSSproducts include coating developing systems, 1X full-field lithography(1XFFL) systems, substrate bonders, flip-chip bonders and probesystems. Headquartered in Munich, Germany, SUSS has 5 internationalmanufacturing sites and provides support from sales and servicecenters in North America, Europe, Asia and Japan. For more informationabout SUSS MicroTec, please visit www.suss.com.

All statements in this release other than historical facts areforward-looking statements within the meaning of U.S. PrivateSecurities Litigation Reform Act of 1995. Words such as "believe","expect", "intend", "anticipate", "estimate", "should", "may", "will","plan" and similar words and terms used in relation to the enterpriseare meant to indicate forward-looking statements of this kind. Thecompany accepts no obligation toward the general public to update orcorrect forward-looking statements. All forward-looking statements aresubject to various risks and uncertainties, as a result of whichactual events may diverge numerically from expectations. Theforward-looking statements reflect the view at the time they weremade.

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