Rudolph Ships MetaPULSE-III to Asia Memory Fab for Copper Interconnect Metrology

Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process characterization systems for the semiconductor manufacturing industry, today announced that it has shipped its next generation MetaPULSE-III™ opaque film metrology tool to a major Asia fab for metrology of copper interconnect in memory devices. A key factor influencing the selection was the tool’s ability to measure all phases of the process, including barrier layer, seed layer, electroplate and CMP using the same metrology system. The delivery marks Rudolph’s early success with the MetaPULSE-III system as memory manufacturers transition from aluminum to copper. "This customer has a long history of using the MetaPULSE on other metal films,” said Ardy Johnson, vice president of marketing at Rudolph. "That experience, coupled with success in development and first-production copper programs, led to this sale. The MetaPULSE system has the ability to cover the entire copper interconnect process with one metrology technology.” "Several Rudolph customers first used the MetaPULSE for barrier/seed layer metrology applications. It met full production requirements, and is now being used during electroplate and post-CMP stages.” Johnson added, "The small spot size of the MetaPULSE system enables fabs to use this tool directly on the product wafer, and the ability to measure line array thickness across the device gives them control of variation in CMP. Mapping the copper interconnect thickness at electroplate provides insight into the variation that we subsequently see at CMP, enhancing control of the overall copper interconnect process.” MetaPulse-III is the leading tool for opaque film measurement of copper interconnect processes in logic ICs, and its market acceptance is one of the reasons over two-thirds of Rudolph revenues are derived from front-end applications. It incorporates Rudolph’s patented picosecond laser sonar (PULSE™) technology, which uses a picosecond pulse of laser energy to send an acoustic wave through the sample. By detecting the return of waves reflected from material interfaces, the tool calculates thickness, modulus and other film characteristics that are necessary to control today’s leading-edge device manufacturing. Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at http://www.rudolphtech.com/. Safe Harbor Statement This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act”). 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Factors that could cause actual results to differ materially from the expectations expressed in such forward-looking statements, include, but are not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph’s business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties as summarized in Rudolph’s Form 10-K report for the year ended December 31, 2007 and other filings with the Securities and Exchange Commission ("SEC”), which are available at http://www.sec.gov, the SEC’s website, and at http://www.rudolphtech.com, the Rudolph website. While these factors may be updated from time to time through the filing of reports and registration statements with the SEC, Rudolph does not assume any obligation to update the forward-looking information contained in this press release.