Kulicke & Soffa to Participate at PCIM Europe 2016

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa”, "K&S” or the "Company”), announced today that it will be exhibiting at the PCIM Europe (Power Conversion and Intelligent Motion) 2016 trade show, international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. The event will be held in Nuremberg, Germany, from May 10 to 12, 2016.

Kulicke & Soffa will be showcasing its market leading packaging solutions in Hall 6 booth number 109.

• The Asterion^TM i-Multi – a compact, multi magazine handler solution designed and integrated for K&S’s latest enhanced capability hybrid wedge bonder. This integrated solution can be customized to handle master card direct bonded copper (DBC) substrates, singulated DBC substrates, modules, flat boat and J-boat carriers.
• The Hybrid – the best solution for Hybrid Power Modules and wafer level packaging, SIP, MCM, FC and Package-on-Package.
• The iFlex T2 PoP – its new design features an increase in feeder capacity, achieving 25% more feeder positions. Combining this increased feeder capacity, with the high volume and high quality iX system delivers the Flexline, which offers best-in-class flexibility, fast changeovers, lower cost-of-ownership and the lowest defect rates.

Chan Pin Chong, Kulicke & Soffa’s Vice President for the Wedge Bonders, Capillaries and Blades Business Lines, said, "PCIM trade show has always been a valuable platform for us to reach our target customers in Europe and promote our R&D advancements. Our focus for the show this year is on interconnect solutions for automotive where K&S has proven solutions in this segment.”

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)

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