FormFactor Introduces New Parametric Test Solution; FormFactor Takumi(TM) Interchangeable Wafer Probe Card Family Further Extends Proven Technology into the Front-End Manufacturing Process

The relentless demand for consumer electronics products withadditional functions in smaller sizes is driving semiconductormanufacturers to fabricate smaller semiconductor devices at shrinkingprocess nodes. These smaller geometries can generate new types ofelectrical device flaws during the fabrication process. Shrinkingprocess nodes increase the need for in-process, electrically precisetesting prior to the traditional functional testing of chips. TheFormFactor Takumi wafer probe solution helps manufacturers addressthese evolving fabrication and test requirements.

Designed for superior parametric test performance, the Takumiwafer probe solution gives semiconductor manufacturers better andfaster insight into opportunities to validate their designs, verifyprocess performance and achieve higher product yields. The proprietaryinterchangeable architecture allows manufacturers to rapidly switchFormFactor probe heads with minimal production downtime. With thisaddition, the FormFactor family of products now addresses the entirewafer test and parameter validation process, from fabrication towafer-level final test.

Inotera Memories Inc., a joint venture of Nanya TechnologyCorporation and Infineon Technologies AG, is using FormFactor TakumiInterchangeable technology in the manufacture of dynamic random accessmemory (DRAM) products. "FormFactor's new parametric TakumiInterchangeable technology has been a boon to Inotera's high-volumeproduction environment," said Cindy Chen, WAT (Wafer Assembly andTest) & Device Dept., WAT Section, Inotera Memories, Inc. "With muchmore consistent, highly accurate testing throughout production, we areable to address problems that ultimately impact device yield at theearliest stage. We are able to upgrade interchangeable probe heads, orInserts, without any downtime on the production floor, and because theInsert lasts more than six times longer than others we've used, ourcost of test continues to drop -- while yield has gone up."

The FormFactor Takumi Interchangeable product line incorporatesthe Company's MicroSpring(R) contact technology -- the advanced,proprietary technology that has transformed wafer-level final test --introducing superior thermal stability, probe positioning accuracy,precision electrical measurement and long test device lifetime intothe parametric test environment. In contrast to conventional probedevices, the Takumi wafer probe solution enables outstanding thermalstability that supports probing from -40 C to 150 C without loss ofproduction time, while extremely accurate and stable electricalmeasurement affords better, faster insight into semiconductorperformance. Precision probe pad placement leads to greater testaccuracy even on a 30umx30um parametric test pad, and provenFormFactor MicroSpring(R) interconnect technology minimizes potentialcontact damage and particle generation.

"The FormFactor Takumi interchangeable product line, which wasdeveloped by our Japan organization, extends the benefits of ourindustry-leading probing technology into front-end manufacturing.Enabling the parametric test roadmap of our customers, FormFactordelivers breakthrough test performance and cost-savings throughout thesemiconductor manufacturing process," said Joe Bronson, president,FormFactor. "This new wafer probe solution will open new markets andnew customers to FormFactor. It is the latest milestone in ourstrategy to offer innovative, comprehensive test solutions fromfabrication to wafer-level final test."

About FormFactor

FormFactor, Inc. (Nasdaq:FORM) is an industry leader in thedesign, development, manufacture, sale and support of precision,high-performance advanced semiconductor wafer probe cards. TheCompany's products are based on its proprietary technologies,including its MicroSpring interconnect technology and designprocesses, which enable FormFactor to produce wafer probe cards fortest applications that require reliability, speed, precision andsignal integrity. FormFactor is headquartered in Livermore,California. For more information, visit the company's web site atwww.formfactor.com.

Forward-Looking Statements

Statements in this press release that are not strictly historicalin nature are forward-looking statements within the meaning of thefederal securities laws, including statements regarding businessmomentum, future growth and the performance of our products. Theseforward-looking statements are based on current information andexpectations that are inherently subject to change and involve anumber of risks and uncertainties. Actual events or results mightdiffer materially from those in any forward-looking statement due tovarious factors, including, but not limited to: the demand for theTakumi interchangeable wafer probe card products; the Company'sability to timely deliver its Takumi wafer probe cards; and theCompany's ability to further create technologies that helpsemiconductor manufacturers realize value in their front-endmanufacturing processes. Additional information concerning factorsthat could cause actual events or results to differ materially fromthose in any forward looking statement is contained in the Company'sForm 10-Q for the period ending June 24, 2005, filed with theSecurities and Exchange Commission ("SEC"), and subsequent filings.Copies of filings made by the Company with the SEC are available athttp://investors.formfactor.com/edgar.cfm. The Company assumes noobligation to update the information in this press release, to reviseany forward-looking statements or to update the reasons actual resultscould differ materially from those anticipated in forward-lookingstatements.