DGAP-News: NanoFocus AG

NanoFocus AG presents the world's fastest confocal sensor for 3D quality control at the SEMICON Taiwan

- New market opportunities, especially in the field of semiconductors

- On board as technological leader for topics of the future

Oberhausen, 12 September 2017 - NanoFocus AG (ISIN: DE0005400667), developer and manufacturer of industrial 3D surface measurement technology, has developed the fastest confocal sensor in the world for 3D quality control that is directly integrated into production processes. It inspects complex microelectronic, micromechanical, mechatronic and optical products and components. The HICOS3D sensor (high-speed confocal sensor for 3D) is especially well-suited for use in the field of semiconductors and opens up new opportunities on the market for NanoFocus. The HICOS3D is being presented for the first time at the SEMICON Taiwan. The world's leading fair for semiconductor production equipment is being held from 13 to 15 September 2017 in Taipeh.

"With the HICOS3D, we are making an important contribution to quality assurance in the production process and to the development of new complex and highly integrated electronic components," says Marcus Grigat, COO of NanoFocus AG. The HICOS3D project was sponsored by the Federal Ministry of Education and Research in the funding initiative "KMU-innovativ: Optische Technologien" (Innovative SMEs and Optical Technologies) as part of the programme "Photonik Forschung Deutschland" (German Photonics Research).

The new confocal high-speed sensor delivers over five million 3D measurement points per second and thus more than fulfils the goal set at the time of the project start: producing the fastest confocal sensor in the world. The HICOS3D offers lateral and axial resolutions that are four times higher than the fastest confocal sensor that existed when the project began. At the same time, NanoFocus increased the measurement speed by 2.5 times. The requirements placed on the measurement technology used in microelectronics are continually increasing in light of increasing performance and simultaneous miniaturisation. Due to the quickly increasing integration density needed for constructing modern smartphones, tablet PCs and other mobile devices, the diameter of electronic connection contacts (bumps) have now decreased to under 30 µm. This trend will continue and create great challenges for the inspection systems for the bumps used in microelectronics in the future where precision and speed are concerned. With the HICOS3D, NanoFocus can make an important contribution to mastering these challenges.

CFO Joachim Sorg: "In the last seven years, NanoFocus has invested in research and development on a large scale. Today, it has a product palette for high-precision surface analysis that is, technologically speaking, unique in the world. In the meanwhile, we are able to assert our leading position in technology with a considerably reduced research budget and position ourselves in issues like 3D printing or the mobility of the future. Thus, we are on board as partners in battery research and developing state-of-the-art fuel cells, sensors as well as camera and tire technology."

About NanoFocus AG:
The NanoFocus Group develops, produces and distributes optical and tactile measurement systems and software for characterising technical surfaces. The measurement systems from NanoFocus make high-precision 3D surface analyses possible in the micrometre and nanometre range. With high measurement and analysis speeds, the systems are suitable for both the inspection lab and for use in production-related areas and inline checks. The measurement systems are successfully used around the world by market and innovation leaders from the medical, automotive, electronics and semiconductor industries.www.nanofocus.de

Disclaimer:
This notification constitutes neither an offer for sale nor an invitation to submit a bid for purchase or subscribe for securities. There are no public tenders for securities of NanoFocus AG. This notification does not constitute a securities prospectus. This notification and the information it contains are not intended for direct or indirect transfer to or within the United States of America, Canada, Australia or Japan.