Carsem Chooses Teradyne ETS-88 to Expand Analog Test Capacity

Teradyne, Inc. (NYSE: TER) announced that Carsem, a leading provider of packaging and test services to the semiconductor industry, has ordered the ETS-88 test system from Teradyne’s Eagle Test Business Unit, adding more capacity to its large Eagle installed base. Carsem will deploy the ETS-88 for testing portable power management and precision analog devices.

"The ETS-88 gives us the manufacturing flexibility to run multiple products and applications simultaneously on a single test system with several modules,” said Iain Meikle, vice president of operations for Carsem. "While utilizing our existing infrastructure and technical development expertise, we have already successfully established on our ETS-364 tester installed base.”

Teradyne’s ETS-88 is a highly scalable multi-site production test system focused on high-volume mixed-signal commodity and precision devices. The system can run multiple independent test applications simultaneously using multiple handlers and probers. The unique system architecture enables full index parallel handler performance and concurrent testing of highly integrated devices.

"Carsem strives to take a technical approach to providing our customers with superior value,” said Rick Flowers, vice president of worldwide sales for Carsem. "The Teradyne ETS-88 tester fits perfectly into Carsem’s value added service approach to testing power management and precision analog devices with the highest efficiency and lowest cost of test.”

"We are pleased that Carsem has selected the ETS-88 to expand its test platform roadmap, continuing a long relationship with Eagle,” said David Anderson, business development manager for Teradyne’s Eagle Test business unit. "With its strong engineering capability, value-added service approach, and commitment to quality, Carsem is a key provider to the semiconductor community in the analog space.”

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Carsem factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia and Suzhou, China. Carsem sales offices are located across the USA, plus the UK and Taiwan, with sales headquarters located in Scotts Valley, CA. For more information, visit www.carsem.com.

About Teradyne

Celebrating its 50th anniversary in 2010, Teradyne (NYSE: TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2009, Teradyne had sales of $819 million and currently employs about 2,900 people worldwide. For more information, visit www.teradyne.com. Teradyne (R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

Editor’s Note: For product photography and other resources, please visit Teradyne’s press room at: http://www.teradyne.com/pressRoom/index.html