Brite Semiconductor, CEVA And SMIC Collaborates On IoT ASIC Platform

(RTTNews) - Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, announced the collaborative development of a design platform roadmap with key industry partners, including Semiconductor Manufacturing International Corporation or SMIC.

The company said the platform is designed to support Internet-of-Things or IoT IC's addressing the China market's emerging needs for smart devices, wirelessly-connected to Cloud infrastructure.

Brite is developing its China IoT ASIC Platform based on SMIC's 55nm low-leakage and ultra-low-power process roadmap,which includes embedded flash memory. Over the design platform's lifetime, these processes can significantly reduce operating voltages to lower both active power and standby power consumption, which will be the best choice for IoT devices including smart home and wearable products.

"An early leader in custom design services in China, Brite is uniquely positioned to work with SMIC foundry services in providing rapid and optimized IoT device realization for China's emerging market opportunities," stated Dr. Charles Zhi, President and CEO of Brite Semiconductor, "Key to IoT applications is wireless connectivity and our CEVA platform cooperation assures seamless connectivity at the periphery of the Cloud."

CEVA, already a Brite and SMIC IP partner, is collaborating with Brite on Bluetooth baseband and DSP platform integration into the China IoT ASIC platform.

In April of this year, The National Center for Advanced Packaging Co., Ltd. joined with Brite to announce a research and development or R&D collaboration targeting single and multi-die Systems-on-Chip or SoCs and System-in-Package or SiPs. This collaboration will include support for the China IoT ASIC Platform roadmap and SoC integration into multi-die packaging which will be a key to successful IoT solutions that integrate sensors, MCUs, and radios into a single package.