Axcelis and IMEC Form Partnership for Sub 45nm Device Technology Devel

    Business Editors/High-Tech Editors

    BEVERLY, Mass.--(BUSINESS WIRE)--Feb. 15, 2005--Axcelis Technologies, Inc. (NASDAQ: ACLS) today announced that the company's new single wafer ion implantation technology platform has been purchased by IMEC, Europe's largest independent nanoelectronics research center, for use in its sub-45nm device development activities. IMEC is the third customer to choose Axcelis' new low energy implant platform, which will be formally unveiled during a live webcast later this week.
    In addition to the sale, Axcelis has become a partner in IMEC's Industrial Affiliation Program (IIAP) for Planar devices, Ultra-shallow junctions, Silicides and Strain (PLUSS) to jointly develop advanced processes for device integration using Axcelis' new single wafer, low energy technology.
    "Joint R&D with key technology leaders like Axcelis is essential for the successful development of device technologies beyond the 45nm technology node," said Dr. Luc Van den hove, vice president, Silicon Process and Device Technology, for IMEC. "We're proud to be working with Axcelis and look forward to leveraging the company's ion implant insights, especially in the areas of low energy beam technology, angle precision and dose control."
    IMEC chose Axcelis' single wafer, low energy platform because it offers the ability to produce highly uniform implants across a broad range of energies, for mid-dose applications, including HALO processes. The system supports implant energies from 500eV all the way to 750keV.
    "We've developed our new single wafer technology to bring greater productivity and doping precision in high-tilt, low energy implant applications - a necessity for transistor development in the 65nm and below technology nodes," said Mike Luttati, Axcelis' chief operating officer. "We look forward to collaborating with IMEC and building on our long-standing relationship."
    As a member of the IIAP PLUSS, Axcelis joins other leading semiconductor companies in developing advanced processes for device integration. IMEC's industrial affiliation programs foster joint R&D focused on a specific topic or technology area between industrial researchers and IMEC research teams. The concept is recognized worldwide as one of the most successful international partnership models for joint development of next-generation technologies.

    Webcast Details

    Axcelis will host a webcast on February 16, 2005 at 1:00 p.m. EST to discuss the Optima platform introduction. The live presentation will be accessible through Axcelis' home page at www.axcelis.com. Prior to the start of the webcast, please access the presentation feed by clicking on "Investors" and "Events" and click on the appropriate icon.
    For audio only and to participate in the Q&A, dial 1-800-967-7135 (1-719-457-2626 outside North America). Participants calling into the conference call will be requested to provide the company name: Axcelis Technologies and the conference leader: James Kawski. A telephone replay will be available from 8:00 p.m. EST on February 16, 2005 until 11:59 p.m. EST on February 23, 2005. Dial 1-888-203-1112 (1-719-457-0820 outside North America), and enter conference ID code #6444767. A webcast replay will be available from 8:00 p.m. EST on February 16, 2005 until 5:00 p.m. EST on March 16, 2005.

    About Axcelis Technologies, Inc.

    Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key product development centers in Beverly, Massachusetts, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

    Forward-Looking Statements

    This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Product manufacturing and delivery issues, customer order push-outs or cancellations and product performance could cause actual results to differ materially from those currently anticipated as expressed in this press release. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.

--30--NC/bo*

CONTACT: Axcelis Technologies, Inc. Company Contact: David Snyder, +1 978-787-4273 david.snyder@axcelis.com or Axcelis Technologies, Inc. Investor Contact: James Kawski, +1 978-787-4000 investor.relations@axcelis.com or Loomis Group Agency Contact: Stacy Grisinger, +1 617-638-0022 grisingers@loomisgroup.com

KEYWORD: MASSACHUSETTS INDUSTRY KEYWORD: HARDWARE MARKETING AGREEMENTS CONFERENCE CALLS SOURCE: Axcelis Technologies, Inc.

Copyright Business Wire 2005